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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
HANDLING OF MOISTURE SENSITIVE PLASTIC PACKAGES
APPLICATION NOTE
ISSUE 3: SEPTEMBER 1997
PMC-Sierra, Inc.
105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000
APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
PMC-Sierra, Inc.
105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000
APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
CONTENTS 1 2 OVERVIEW .............................................................................................. 1 BACKGROUND........................................................................................ 2 2.1 2.2 2.3 2.4 3 PACKAGE CONSTRUCTION AND DELAMINATION .................... 2 MAXIMUM ALLOWABLE CONCENTRATION OF WATER ............ 3 ABSORPTION RATES .................................................................. 3 DESORPTION RATES .................................................................. 4
DRY BAGS AND BOXES ......................................................................... 5 3.1 3.2 DRY BAGS .................................................................................... 5 DRY BOXES.................................................................................. 5
4 5 6
QUALIFICATION STANDARDS ................................................................ 6 THE HUMIDITY BUDGET........................................................................ 8 CUSTOMER SITE REQUIREMENTS .................................................... 10 6.1 6.2 6.3 6.4 6.5 GENERAL ................................................................................... 10 INCOMING INSPECTION ........................................................... 10 STORAGE OF UNUSED COMPONENTS .................................. 10 SYMPTOMS OF POPCORNING................................................. 11 WHAT TO DO IF POPCORNING IS SUSPECTED ..................... 11
7 8
REFERENCES AND FURTHER READING........................................... 12 APPENDIX A - BAKE OUT WORK INSTRUCTIONS............................. 13 8.1 8.2 8.3 OBJECTIVE ................................................................................ 13 EQUIPMENT ............................................................................... 13 MATERIALS ................................................................................ 13
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
8.4 8.5 9
DEVICES IN BAKEABLE TRAYS ................................................ 13 DEVICES IN TUBES, TAPE AND REEL, OR NON-BAKEABLE TRAYS......................................................................................... 14
APPENDIX B - PUNCTURED BAG VS NORMAL BAG ......................... 15 9.1 9.2 NORMAL BAG ............................................................................ 15 PUNCTURED BAG ..................................................................... 16
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
LIST OF FIGURES FIGURE 1 - PLASTIC SURFACE MOUNT DEVICE (PSMD) ............................ 2 FIGURE 2 - DELAMINATION SITES ................................................................. 2 FIGURE 3 - LARGE DIE / THINNER PACKAGE ............................................... 3 FIGURE 4 - TYPICAL HUMIDITY BUDGET ...................................................... 9
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
LIST OF TABLES TABLE 1 TABLE 2 TABLE 3 - ABSORPTION RATES................................................................... 4 - JEDEC - A113 STANDARDS ......................................................... 6 - JEDEC - A113 REFLOW SIMULATION ......................................... 7
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
1
OVERVIEW "Popcorn" is an industry phenomenon affecting small plastic packages which got its name due to the distinctive popping sound made when a molded package cracks. Plastic packaged chips that have been exposed to humid environments may be damaged during board assembly. The plastic can absorb moisture that, upon heating during solder reflow operations, will cause it to delaminate from the die or leadframe. This delamination may cause the packages to crack and/ or wirebonds to break resulting in a non-functional circuit. The objective of this document is to outline the process that must be followed, by PMC-Sierra and its customers to ensure that the moisture content of the plastic packages is at a safe level before board assembly.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
2 2.1
BACKGROUND Package Construction and Delamination Figure 1 shows the cross section of a Plastic Surface Mount Device (PSMD). The molding compound (or plastic) encapsulates the device giving mechanical and environmental protection. Figure 1 - Plastic Surface Mount Device (PSMD)
Wire Die
Die Attach
Molding Compound Leadframe Paddle
Figure 2 shows a device which has delaminated. For delamination to occur there must be moisture in the package and this moisture must be vaporized causing pressure build up in the package. Moisture may be absorbed when the parts are exposed to humid air. The level of humidity in the air required is discussed below, in general, the humidity in a normal room is high enough to cause the package to absorb water. The moisture may be vaporized during board assembly. The rate of heating and highest Temperature achieved during reflow are as important as the water level in the package. Figure 2 - Delamination Sites
Plastic to Die Delamination
Crack Formed as Result of Delamination
Paddle to Plastic Delamination
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
2.2
Maximum Allowable Concentration of Water The level of diffused water, as a percentage of total weight (% wt.), at which popcorn damage may occur will depend on the plastic (molding compound) , die attach material used, die attach coverage, lead frame design, thickness of plastic over the die and the die size. Figure 3 shows a more popcorn sensitive device a large die in a small thin package. In this case water diffuses quicker to the bulk of the plastic and there is less partial pressure of vapor required to cause a rupture. There is clearly a trade-off between density and popcorn potential. Board Assemblers who can control the humidity present in devices have a competitive advantage over those who don't as they can create denser boards. Figure 3 - Large Die / Thinner Package
2.3
Absorption Rates The rate of water absorption is a function of the environment and the initial humidity For parts exposed in the PMC-Sierra clean room, (25 deg C/50% RH) absorption measurements show that the moisture content rises from 0.05% wt. to approximately 0.1% wt. in approximately 72 hours. Table 1 below (ANSI/IPCSM-768) shows industry data for similar experiments. It can be seen that the PMC-Sierra data predicts a 20% shorter absorption time than the ANSI/IPC data but is probably within experimental error.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
Table 1
- Absorption Rates Initial Moisture Content 0.05 0.05 0.05 0.08 0.08 0.08 Time to 0.11% (hours) 100 75 92 60 30 48
Environment (C/%RH) 25/50 25/85 30/60 25/50 25/85 30/60 2.4 Desorption Rates
When the plastic packages are baked in air at 125C, desorption measurements indicate that half the moisture content is removed every 12 hours. The Saturated Water Level a package can support is less than 0.30 %, therefore, when the moisture content of a plastic package is not known, it is safe to assume, that a bake of 24 hours at 125 deg C will ensure that the moisture content is below 0.075%, which ensures safe assembly for all PMC-Sierra Parts.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
3 3.1
DRY BAGS AND BOXES Dry Bags Dry Bagging and Dry Bags are discussed in PMC-931210 "Procedure for Dry Bagging Moisture Sensitive Plastic IC Packages". The specifications for the bags and their labels and desiccants are stated there. A Dry Bag or Moisture Barrier Bag does not let external water vapor enter. If sufficient desiccant is in the bag the ambient will always have low humidity eliminating any water absorption while the devices are bagged.
3.2
Dry Boxes Environments with relative humidities below 20% will cause the devices to lose or maintain their moisture level. Therefore storage in a suitable "dry box" with humidity less than 20% is acceptable. The dry box may be fed by Clean Dry Air or Dry Nitrogen. The dry box must be monitored with a hygrometer and flow meter to ensure compliance to the humidity requirement.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
4
QUALIFICATION STANDARDS The standard method used to specify the allowable device time out of bag is to qualify the package using the method of JEDEC - A113 "Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing". In this technique devices are pre-loaded (soaked) with moisture for a specified period of time as shown in Table 2 and then subjected to three simulated solder reflow profiles as shown in Table 3. Table 2 LEVEL 1 2 3 4 5 6 - JEDEC - A113 Standards Soak Time (hours) 168 168 168* 72* 24/48* 6 Humidity (deg C / %RH) 85/85 85/60 30/60 30/60 30/60 30/60
* In actual fact the soak time is increased by 24 hours to allow for IC Manufacturers out of bag time. Following this the devices are subjected to standard endurance testing (HTOL, T/C, and THB). All PMC-Sierra devices pass Level 3 (168 hours or 1 week out of the bag).
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
Table 3 Process
- JEDEC - A113 Reflow Simulation Duration / Temperature Maximum 6 Deg C / Second 120 Seconds max. 120-180 Seconds 10-40 seconds 220 +/- 5 Deg C Maximum -6 Deg C / Second
Ramp Up Rate Temperature Maintained at 125 Deg C Temperature Maintained above 183 Deg C Time at Maximum Temperature Maximum Temperature Ramp Down Rate
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
5
THE HUMIDITY BUDGET Figure 4 shows a typical humidity budget for PSMDs as they flow from IC assembly to PCB assembly. The actual water absorbed may be more or less as previously discussed. The flow is arranged so that customers will have a minimum 168 hours out of the bag shelf life under 30 deg C and 60% RH conditions. PSMDs are specified to have less than 0.05% water weight when leaving assembly. This is achieved by baking and sealing in a moisture barrier bag containing sufficient desiccant and a humidity indicator card as specified in PMC931210 Procedure for Dry Bagging of Moisture Sensitive Devices. The production test procedures are controlled such that no more than 0.02% is added during these steps. This is done by limiting the exposure to 30/60 environment to no more than 20 hours. At all other times the parts are sealed in dry bags or stored in dry boxes. At the end of production test the devices are re-sealed in an ESD shielded bag containing sufficient desiccant and a humidity indicator card as specified in PMC931210 Procedure for Dry Bagging of Moisture Sensitive Devices. If at any point the parts have been exposed for more than the allotted 20 hours, or, a puncture in the bag has been noted the parts are re-baked for 24 hours at 125 deg C as per PMC-940101 Procedure for the Bake Out of Moisture Sensitive Plastic IC Packaged Devices.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
Figure 4
0.19%
- Typical Humidity Budget
0.12%
Open Bag Waiting for PCB Assembly
168 hours (30C/60%
0.07% 0.00% 0.02% 0.05% 0.00%
Shipping and Storage
12 months (dry bag)
Final Test and QA Shipping and Pretest Storage 12 weeks (dry bag)
0.05% 0.00% Total Humidity (in % by weight) IC Assembly Bake till 0.05%
Operation
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
6 6.1
CUSTOMER SITE REQUIREMENTS General Production Areas should have Temperature less than 30 deg C and relative humidity less than 60%. Any Dry Boxes used must have relative humidity below 20% and temperature less than 30 deg C. If at any point the conditions of this procedure are not met the devices must be baked at 24 hours for 125 deg C as per PMC-940101. "ANSI/IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs" provides excellent guidelines to supplement the above information.
6.2
Incoming Inspection Before opening a sealed bag check for bag integrity. No holes, gouges, tears, or puncture of any kind are allowed. The seal date should be checked and if it has expired the devices must be re-baked. The bag should be opened by cutting a slit as near as possible to the seal. Upon opening a sealed bag, note the condition of the humidity indicator card. If the 20% RH dot has turned pink and the 30% RH dot is not blue the devices must be re-baked as per PMC-940101. If the bag is intact and the humidity indicator card is in the correct state, the devices may be released to board assembly. See Appendix B for photographs of an intact bag and a bag which has been punctured. Bags which have been punctured will typically have a slightly inflated look to them.
6.3
Storage of Unused Components The PSMDs may be stored, unbagged, in a dry box or re-sealed dry bag for up to 1 year depending on the date of original sealing as indicated on the bag label. The devices may be left UN-sealed for a period of time as specified in the label (usually 48 or 168 hours). If the environment of the room is better than 30 deg C and 60% Relative Humidity the devices may be left unsealed slightly longer. If a dry bag sealer is not available it is best to fold the end of the bag over for temporary storage.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
6.4
Symptoms of Popcorning A visible crack on the package (usually visible with a 10X lens) is a sure sign of popcorning. Since the crack may not always be visible or even extend to the surface of the package other indicators are useful. A good indicator is "open circuited" pins which can be checked for by removing a device from the board and "beeping" signal pins with respect to ground pins - a diode should be present on all signal pins. Often open circuit output pins show up on board test to be apparently stuck at "zero" - so it is a good idea to assume that stuck at "zero" pins may be in fact open circuit.
6.5
What to do if popcorning is suspected If popcorning is suspected, it is important to stop assembly as devices cannot be recovered after they have been popcorned but they can be saved by baking before assembly. If some of the symptoms noted above are present a good test is to hand solder a device from the same batch onto the board - hand soldering does not in general generate enough heat to popcorn the device. If the hand soldered device functions try baking the rest of the batch and doing a limited assembly run. If the failures persist they are probably not the result of popcorning.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
7
REFERENCES AND FURTHER READING PMC-931210 Procedure for Dry Bagging Moisture Sensitive Plastic IC Packages PMC-940101 Procedure for the Bake Out of Moisture Sensitive Plastic IC Packaged Devices ANSI/IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs Contact: IPC 7380 N. Lincoln Ave. Lincolnwood, Illinois 60646-1705 Tel 708 677 2850 Fax 708 677 9570 JESD22 - A113-A Reliability Testing Preconditioning of Plastic Surface Mount Devices Prior to
Contact: Global Engineering Documents 15 Inverness Way East Englewood, CO 80112-5074 Tel 1-800-854-7179 or 303-397-7956
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
8 8.1
APPENDIX A - BAKE OUT WORK INSTRUCTIONS Objective The objective of this procedure is to ensure that the moisture content of the plastic packages has been lowered to a safe level (0.08 % by weight) by baking.
8.2
Equipment 1. Blue M Convection Oven (Other ovens capable of 125 deg C may be used) 2. Anti-static gloves and strap 3. Vacuum pick-up tool (non-bakeable trays/tubes only) 4. Metal tray (non-bakeable trays/tubes only)
8.3
Materials 1. Plastic parts for baking 2. Bakeable plastic shipping trays
8.4
Devices in Bakeable Trays 1. Consult the oven schedule to make sure it is available to use for 24 hours. 2. Set the temperature set point to read 125C 3. Verify that the trays holding the parts can be baked to a maximum temperature exceeding 125C. If the tray is bakeable, the maximum temperature will be written on the tray. If the tray is not bakeable use the procedure in the next section. 4. Remove the nylon straps holding the trays together. Care must be taken that the trays do not separate to prevent the parts from moving, causing the leads to be damaged. 5. Keep the trays grouped by part and assembly lot. 6. Place the trays in the oven for 24 hours.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
7. On completion of the bake cycle remove the trays from the oven using the oven mitts. Allow the parts to cool for one hour. 8. Re-strap the trays securely. For PQFPs, PMC-Sierra boxing allows for 5 full height trays with an empty tray as a cover and 10 half height trays with an empty tray as a cover per box. Except for special requests or at the end of a lot, the number of parts in a box will be the maximum that may be contained in the trays. 8.5 Devices in tubes, tape and reel, or non-bakeable trays 1. Consult the oven schedule to make sure it is available to use for 24 hours. 2. Set the temperature set point to read 125C 3. Remove the parts from the anti static tubes, tape, or non-bakeable tray and place them on metal trays using proper ESD precautions. Trays may be foil lined to prevent lead wear. 4. Keep the trays grouped by part and assembly lot. 5. Place the trays in the oven for 24 hours. 6. On completion of the bake cycle remove the trays from the oven using the oven mitts. Allow the parts to cool for one hour. 7. Load the parts back into the anti static tubes, using proper ESD precautions, keeping them grouped by part and assembly lot. For PLCCs, PMC-Sierra boxing allows for 25 tubes per box. Except for special requests or at the end of a lot, the number of parts in a box will be the maximum that may be contained in the 25 tubes.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
9 9.1
APPENDIX B - PUNCTURED BAG VS NORMAL BAG Normal Bag
In a normal bag the ribs of the internal tray are clearly visible. If the expiry date hasn't been reached on this bag and the HIC reading is satisfactory then the parts are usable without baking.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
9.2
Punctured Bag
A punctured bag has a slightly inflated look - the parts in this bag should be baked before use.
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
NOTES
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APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES
CONTACTING PMC-SIERRA, INC. PMC-Sierra, Inc. 105-8555 Baxter Place Burnaby, BC Canada V5A 4V7 Tel: Fax: (604) 415-6000 (604) 415-6200 document@pmc-sierra.com info@pmc-sierra.com apps@pmc-sierra.com http://www.pmc-sierra.com
Document Information: Corporate Information: Application Information: Web Site:
None of the information contained in this document constitutes an express or implied warranty by PMC-Sierra, Inc. as to the sufficiency, fitness or suitability for a particular purpose of any such information or the fitness, or suitability for a particular purpose, merchantability, performance, compatibility with other parts or systems, of any of the products of PMC-Sierra, Inc., or any portion thereof, referred to in this document. PMC-Sierra, Inc. expressly disclaims all representations and warranties of any kind regarding the contents or use of the information, including, but not limited to, express and implied warranties of accuracy, completeness, merchantability, fitness for a particular use, or non-infringement. In no event will PMC-Sierra, Inc. be liable for any direct, indirect, special, incidental or consequential damages, including, but not limited to, lost profits, lost business or lost data resulting from any use of or reliance upon the information, whether or not PMC-Sierra, Inc. has been advised of the possibility of such damage. (c) 1997 PMC-Sierra, Inc. PMC-951041 (R3) Issue date: September 1997
PMC-Sierra, Inc..
105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000

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